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Are probes really that important for the inspection of semiconductor chips? This is how we can tell if a probe is good or bad.

Understanding Probes

Semiconductor chip production management steps can be roughly divided into system design, manufacturing and packaging, semiconductor probes are mainly used in the semiconductor chip product design method verification, wafer testing, finished product testing work links, is throughout the entire chip enterprise production process core components.

The probe is generally composed of four basic parts: the head, the tail, the spring and the outer tube, which are riveted and pre-pressurized by precision instruments. Due to the small size of semiconductor products, the size of the probe is required to reach the micron level.

The probes are applied to the precision connection between wafer pins or solder balls and testers to realize signal transmission in order to detect the conductivity, current, function, aging and other performance indexes of the products.

Produced probes, whether the structural design is carried out reasonably, the size of the error analysis can be reasonable, whether the needle has the original deflection, whether the peripheral insulation layer of ordinary probes have integrity and so on these issues, will directly affect the accuracy of the test results of the probe, which in turn affects the semiconductor chip enterprise product testing and verification of the teaching effect.

Detection difficulties

Due to the small size of the probe itself, the precision of the vision system is required to be high.

At the same time, the reasonableness of the overall structure of the probe needs to be tested, and there are also high requirements for the field of view.

In order to prevent corrosion and improve stability and durability, the exterior of the probe is gold-plated, which leads to strong reflections on the exterior of the probe, and the vision system also needs to overcome this difficulty.