
The semiconductor industry, driven by escalating demands in communication devices, consumer electronics, and automobiles, is witnessing a surge in global chip prices due to a profound chip shortage. Amid the intricate chip manufacturing process, materials like wafers, electronic specialty gases, optical masks, and photoresists receive considerable attention. Yet, the role of engineering plastics in safeguarding the semiconductor manufacturing process often goes unnoticed.
A primary challenge in semiconductor manufacturing is pollution control, given the industry's evolution toward smaller, more intricate electronic components and stringent production conditions. Engineering plastics play a crucial role in pollution prevention, resource optimization, and improving yields across key semiconductor processes in China.
Various engineering plastics, including PEEK, PPS, PP, ABS, PVC, PBT, PC, fluorine plastic, PAI, COP, etc., contribute to the semiconductor industry's evolving landscape. As China's semiconductor technology advances, the demand for high-performance materials continues to rise.
This focus narrows down to the application of specialized engineering plastics, particularly PEEK/PPS, in semiconductor manufacturing:
1. CMP Fixed Ring
Purpose: Chemical mechanical polishing (CMP) is integral to wafer production. The CMP fixed ring secures silicon wafers during the polishing process.
Material: Standard PPS is commonly used for CMP fixing rings, but PEEK surpasses PPS in wear resistance, doubling the service life and enhancing wafer productivity.
2. Wafer Carriers
Purpose: Wafer carriers, including boxes and boats, play a vital role in wafer transportation and storage.
Material: PEEK, especially antistatic PEEK, offers superior properties such as abrasion resistance, chemical resistance, dimensional stability, and low outgassing, ensuring the reliability of wafer handling and transfer.
3. Photomask Box
Purpose: The photomask box safeguards masks used in chip manufacturing lithography, preventing contamination and damage.
Material: PEEK, with its high hardness, low outgassing, anti-static properties, and chemical resistance, ensures the cleanliness and protection of photomasks during storage and handling.
4. Wafer Tools
Purpose: Tools like wafer clamps and vacuum pens, made from materials like PEEK, prevent scratches and residue on wafer surfaces during handling.
Material: PEEK's high temperature resistance, wear resistance, and low outgassing characteristics contribute to improved cleanliness of wafer surfaces.
5. Semiconductor Package Test Socket
Purpose: Test sockets facilitate electrical connections for semiconductor components during testing and analysis.
Material: Test sockets demand materials with good size stability, mechanical strength, low burr formation, durability, and easy processing over a wide temperature range, making PEEK a suitable choice.
In conclusion, engineering plastics, particularly PEEK and PPS, emerge as indispensable contributors to pollution control, resource optimization, and improved yields in China's semiconductor manufacturing. As the industry advances, the demand for high-performance materials and their applications will continue to evolve.
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